Fiber Laser Systems
High-power, low-maintenance fiber laser platforms engineered for precision SMT stencil cutting and metal micromachining. Trusted by leading electronics manufacturers worldwide.
G680PRO
Compact SMT stencil precision — 15,000–30,000 pads/h
The entry-tier of our new-generation SMT stencil platforms. Built on a granite base with a gantry dual-drive motion system, driven by an original IPG fiber source. Ideal for high-mix, mid-volume stencil shops.
- Ultra-precise SMT stencil cutting
- Precision metal parts and shims
- Mini-LED micro-aperture cutting
- German IPG fiber laser — long life, maintenance-free
- Pure O₂ / compressed air cutting with real-time pressure monitoring
- Upgraded gantry dual-drive motion platform
- Visualized HY CUT control software
- One-click aperture repair, power-off memory
- Vision alignment with automatic offset compensation
| Parameter | G680PRO |
|---|---|
| Cutting speed | 15,000–30,000 pads/h |
| Cutting area | 680 × 680 mm |
| Thickness | ≤ 0.5 mm |
| Accuracy | ± 0.005 mm |
| Repeatability | ± 0.002 mm |
| Laser source | IPG fiber (100 W / 200 W) |
| Frame size (max) | 740 × 1500 × 40 mm |
| Foil size (max) | 760 × 760 mm |
| Machine size | 1550 × 1400 × 1550 mm |
| Weight | 2400 kg |
| Software | HY CUT · STC / DXF / GBR / LMD |
Cutting Samples
G6080 / G6080S
The workhorse — up to 50,000 pads/hour
The G6080 platform pairs the fastest cutting speeds in its class with micron-level accuracy. Suitable for high-throughput SMT lines and server / telecom-grade specialty stencils.
- High-throughput SMT stencil production
- Server / telecom specialty stencils
- Mini-LED and micro-aperture parts
- Upgraded high-precision aperture-repair mode
- Upgraded vision positioning algorithm
- Standard parameter library for one-click setup
- One-key auto Z-focus adjustment
- Optional MES with phone / tablet / PC live monitoring
- Compatible with STC / DXF / GBR / LMD directly
| Parameter | G6080 | G6080S |
|---|---|---|
| Cutting speed | 20,000–50,000 pads/h | 20,000–50,000 pads/h |
| Cutting area | 600 × 800 mm | 600 × 800 mm |
| Thickness | ≤ 0.5 mm | ≤ 0.5 mm |
| Accuracy | ± 0.005 mm | ± 0.005 mm |
| Repeatability | ± 0.002 mm | ± 0.002 mm |
| Laser source | IPG 100 / 200 W | IPG 100 / 200 W |
| Machine size | 1580 × 1420 × 1550 mm | 1580 × 1420 × 1550 mm |
| Weight | 2200 kg | 2200 kg |
| Foil size (max) | 900 × 600 mm | 900 × 600 mm |
| Power supply | AC 220 V / 2 kW | AC 220 V / 2 kW |
Cutting Samples
G6120 / G6120S
Extra-long format for 5G, server and new-energy
The 1200-mm-format platform for extra-long stencils used in 5G base-stations, telecom, and new-energy applications. G6120S adds a 500 W IPG source for stencils up to 1.5 mm thick.
- Ultra-long SMT stencils (up to 1320 mm)
- 5G / telecom base-station stencils
- Thick specialty stencils up to 1.5 mm (S model)
- Upgraded positioning-accuracy compensation for rail deflection
- Temperature-compensation algorithm for on-site drift
- New path-planning algorithm reduces short-segment cutting time
- New cutting head + nozzle for micro-hole quality
- Free bundled CircuitCAM 7.5
| Parameter | G6120 | G6120S |
|---|---|---|
| Cutting speed | 20,000–50,000 pads/h | 15,000–30,000 pads/h |
| Cutting area | 600 × 1200 mm | 600 × 1200 mm |
| Thickness | ≤ 0.5 mm | ≤ 1.5 mm |
| Accuracy | ± 0.005 mm | ± 0.005 mm |
| Repeatability | ± 0.002 mm | ± 0.002 mm |
| Laser source | IPG 100 / 200 W | IPG 500 W |
| Foil size (max) | 1320 × 600 mm | 900 × 600 mm |
| Machine size | 2080 × 1500 × 1550 mm | 2275 × 1200 × 1550 mm |
| Weight | 3200 kg | 2600 kg |
| Power supply | AC 220 V / 3 kW | AC 220 V / 3 kW |
Cutting Samples
