One micron of precision. Every industry we touch.
From SMT stencils to fingerprint chips, sapphire cover glass to conductive adhesive films — see how HOYAN LASER platforms deliver.
Precision Metal
Ultra-precision cutting, drilling and micromachining for stainless, tin foil, molybdenum, copper, nickel and specialty alloys.
PCB / FPC
Cold-process cutting, drilling and windowing for flex-circuits, cover-films, rigid-flex and HDI substrates.
Brittle Materials
Micro-hole drilling, precision cutting and slot machining for sapphire, glass, ceramic substrates and optical filters.
Specialty Materials
Cold-process cutting for fingerprint chips, ferrite sheets, and conductive/functional adhesives used in modern electronics.
Laser Marking & Engraving
Ultra-fine marking and engraving on watch dials, inside sapphire and glass, and other high-value surfaces.
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