UV & Green Laser Systems
Cold-processing UV and green laser platforms for FPC/PCB depaneling, cover-film opening, ceramic drilling, fingerprint chip singulation and other thin-film precision jobs.
MS1030P / MS1040P / MS1050P (MicroScan MS Series)
Entry-format UV / green depaneling — from 300 × 350 mm
Compact UV / green laser cutting platforms for FPC, PCB, cover film, PI, FR4 and sensor packaging. Compatible with UV-ns, green-ns, UV-ps and green-ps sources for a broad process window.
- FPC / PCB external cutting and drilling
- Cover-film and electromagnetic-film window opening
- Sony adhesive, PI, FR4, TF-card depaneling
- Fingerprint chip singulation, camera module cutting
- Multi-layer rigid-flex cover opening, QR marking
- 0.2 µm resolution, ± 0.002 mm linear accuracy
- Cutting speed up to 5000 mm/s
- 5 MP CCD auto-alignment · auto-scaling compensation
- ScanCutPro control software (proprietary)
- Fully enclosed light path with fume extraction
| Parameter | MS1030P | MS1040P | MS1050P |
|---|---|---|---|
| Cutting range | 300 × 350 mm | 400 × 500 mm | 500 × 600 mm |
| Laser source | UV / green ns or ps compatible | — | — |
| Resolution | 0.2 µm | 0.2 µm | 0.2 µm |
| Linear accuracy | ± 0.002 mm | ± 0.002 mm | ± 0.002 mm |
| Repeat accuracy | ± 0.002 mm | ± 0.002 mm | ± 0.002 mm |
| Machine accuracy | ± 0.005 mm | ± 0.005 mm | ± 0.005 mm |
| Motion speed | ≤ 1000 mm/s | ≤ 1000 mm/s | ≤ 1000 mm/s |
| Cutting speed | 500–5000 mm/s | 500–5000 mm/s | 500–5000 mm/s |
| Spot size | ≤ 0.02 mm | ≤ 0.02 mm | ≤ 0.02 mm |
| Cutting thickness | ≤ 1 mm | ≤ 1 mm | ≤ 1 mm |
| Weight | 800 kg | 1100 kg | 1500 kg |
MicroScan 5000D / 5000P
Dual-head, dual-platform depaneling for volume FPC
Purpose-built for FPC and PCB volume production. Dual-platform, single- or dual-head configurations enable simultaneous cutting on two stations with ± 25 µm process accuracy and CPK ≥ 1.33.
- FPC single- and double-sided depaneling
- PCB / FR4 external cutting
- Cover-film precision windowing
- Camera module singulation
- Dual-platform switching for zero idle time
- Large 600 × 600 mm format available
- International-brand UV / green ps or ns source
- Ironless linear motor motion for micron accuracy
- CCD auto-alignment · auto scaling · MES-compatible output
- DataMatrix / QR code cutting support
| Parameter | MicroScan 5000D / 5000P |
|---|---|
| External dims | 1500 × 1600 × 1800 mm ± 20 mm |
| Weight | 2200 kg |
| Power | 3∅ 5-wire AC 380 V / 63 A |
| Working area | 350 × 500 mm (dual) / 650 × 520 mm (single) |
| Single laser | UV/green ns or ps · 15–60 W |
| Dual laser | UV/green ns · 15–35 W |
| Spot size | UV 20 ± 5 µm · Green 25 ± 5 µm |
| Cutting speed | 1000–2000 mm/s standard · 500–1000 mm/s double-sided FPC |
| Min hole | 0.3 mm |
| Process accuracy | ± 25 µm · CPK ≥ 1.33 |
| X-Y accuracy | ± 5 µm |
| Repeat alignment | ± 2 µm |
MicroScan 6000PII
Gantry + fly-optics — in-line ready
Gantry-structure single-platform machine designed to plug into automated FPC/PCB lines with dedicated loading/unloading. Cutting sections, layer-selective depaneling and area-selective cutting all in one pass.
- In-line FPC / PCB external cutting and drilling
- Cover-film window opening
- Fingerprint chip and TF-card singulation
- Camera module cutting, QR marking
- Gantry structure + fly-optics for line integration
- Sectional / layered / region-selective cutting in one setup
- High-resolution branded CCD for auto-alignment and focus
- Vision model capture for arbitrary feature points
- Fume extraction system for operator safety
| Parameter | MicroScan 6000PII |
|---|---|
| External dims | 1150 × 1600 × 1800 mm ± 20 mm |
| Weight | 1500 kg |
| Working area | 460 × 520 mm |
| Cutting speed | 1000–2000 mm/s cover-film · 500–1000 mm/s double-sided FPC |
| Min hole | 0.3 mm |
| Process accuracy | ± 25 µm · CPK ≥ 1.33 |
Copper-Foil UV Micro-Drilling Machine
300 holes/sec @ 100 µm for FPC copper foil
Roll-to-sheet or sheet-to-sheet copper-foil drilling platform using 20 W UV laser for 50 µm minimum holes at 300 holes/second per 100 µm aperture.
- FPC copper-foil micro-drilling
- High-density interconnect via generation
- Precision shim and connector prep
- 50 µm minimum hole diameter
- ± 20 µm process accuracy · CPK ≥ 1.67
- ± 2 µm repeat alignment
- Fully-automatic reel-to-sheet feeding option
- Closed-loop first-brand power meter monitoring
| Parameter | Copper-Foil UV Micro-Drilling Machine |
|---|---|
| Working area | 270 × 500 mm |
| Reel width | ≤ 250 mm · length < 100 m |
| Sheet size | Max 250 × 500 mm |
| Laser | UV 20 W · spot 20 ± 5 µm |
| Drill rate | 300 holes/s @ 100 µm |
| Min hole | 50 µm |
| Weight | 2500 kg |
GD 2550B — Dual-Head Cover-Film Reel-to-Sheet
355 nm picosecond · dual-head reel-to-sheet
Fully-automatic dual-head, dual-platform reel-to-sheet cover-film cutter. Enclosed light path, marble base, and MES-ready control designed for volume FPC / PCB cover-film production.
- Cover-film reel-to-sheet volume cutting
- Electromagnetic-film windowing
- PI / adhesive film precision cutting
- Picosecond 355 nm UV source · >30 W @ 500 kHz
- Dual-head simultaneous processing on two platforms
- Elevating fume extraction for clean cutting
- Real-time remote monitoring via MES
| Parameter | GD 2550B — Dual-Head Cover-Film Reel-to-Sheet |
|---|---|
| Cutting range | 250 (X) × 500 (Y) × 2 |
| Laser | Picosecond 355 nm · > 30 W @ 500 kHz · < 12 ps |
| Motion platform | Marble · resolution 0.2 µm |
| Linear / repeat accuracy | ≤ ± 0.002 mm |
| Cutting speed | 500–5000 mm/s |
| Machine dims | 1450 × 1130 × 1750 mm |
| Weight | 1500 kg |
Micro SD Card Laser Cutting Machine
Dual-laser dual-platform SD / TF card singulation
High-power green nanosecond laser platform for fully-automatic Micro SD / TF card singulation with automated loading/unloading and 8-magazine outfeed.
- Micro SD / TF card singulation
- PCB / RF4 hard-board depaneling
- Dual green nanosecond lasers (35 W each)
- Precision marble motion platform
- Machine accuracy ± 0.02 mm
- Auto load / unload · 30 s cycle
| Parameter | Micro SD Card Laser Cutting Machine |
|---|---|
| External dims | 2250 × 1800 × 1950 mm ± 20 mm |
| Weight | 3200 kg |
| Working area | 330 × 330 mm |
| Magazine capacity | 0–400 pcs · 8 outfeed magazines |
| Load/unload cycle | 30 s |
| Cutting speed | 500–1500 mm/s |
| Min hole | 0.5 mm |
MicroScan 6500
Large-format UV depaneling for high-mix FPC / PCB
Large-format UV platform extending the MicroScan family for wider panels, combining galvo scanning with a marble motion base for stable ± 25 µm process accuracy.
- Large-format FPC / PCB depaneling
- Cover-film and PI window opening
- Multi-layer rigid-flex processing
- Large working area with fly-scan stitching
- 5 MP CCD alignment with scaling compensation
- ScanCutPro control software
- Fully enclosed light path with fume extraction
| Parameter | MicroScan 6500 |
|---|---|
| Laser source | UV 355 nm · ns / ps |
| Working area | 600 × 500 mm |
| Process accuracy | ± 25 µm · CPK ≥ 1.33 |
| Cutting speed | 500–5000 mm/s |
MicroDrill 5250-RTP-A / CVL6000
Roll-to-roll UV drilling & marking
Roll-to-roll UV drilling and QR-marking platform for continuous flexible-material production, paired with the CVL6000 vision-linked handling unit for unattended running.
- Roll-to-roll micro-drilling on PI / FPC
- Continuous QR / data-matrix marking
- Reel-fed flexible circuit processing
- Continuous reel-to-reel feeding with tension control
- On-the-fly vision alignment
- Traceability marking with MES link
- Unattended production capability
| Parameter | MicroDrill 5250-RTP-A / CVL6000 |
|---|---|
| Laser source | UV 355 nm ns |
| Web width | ≤ 300 mm |
| Min hole | 0.05 mm |
| Process accuracy | ± 25 µm |
MicroScan 3300-DD-GR-A / 3250-A
Green-laser precision cutting for brittle materials
Green (532 nm) laser platforms for brittle and heat-sensitive materials — ceramic substrates, sapphire, glass and thin sensor stacks — with dual-drive motion for low-stress cutting.
- Ceramic substrate and sapphire cutting
- Glass and filter micro-machining
- Sensor and fingerprint chip singulation
- 532 nm green source · low heat-affected zone
- Dual-drive precision motion platform
- Vision alignment with auto compensation
- Chip-free, crack-free edge quality
| Parameter | MicroScan 3300-DD-GR-A / 3250-A |
|---|---|
| Laser source | Green 532 nm · ns / ps |
| Working area | 330 × 330 mm |
| Process accuracy | ± 20 µm |
| Cutting speed | 500–3000 mm/s |