BGA · Substrate · Advanced Packaging
Semiconductor & IC Packaging
Micron-scale drilling, BGA solder-mask windowing and substrate depaneling — critical steps behind modern IC packaging supported by HOYAN LASER micromachining platforms.
Challenges
What this sector demands
Micron-hole arrays with zero conductor damage
Selective removal of solder-mask over BGA pads
Non-contact cutting for brittle substrates
Repeatability across 200 mm and 300 mm formats
Processes
How HOYAN LASER answers
BGA solder-mask opening
UV nanosecond selective ablation with copper protection.
IC substrate depaneling
Green / UV picosecond cutting, zero-taper edges.
Ceramic micro-hole drilling
Micron array holes on AlN / Al₂O₃ substrates.
Wafer-level QR marking
Roll-to-roll traceability inside the packaging line.
Key metrics
Precision, at a glance
≤ 0.02 mm
Spot size
± 2 µm
Repeat accuracy
0
Recast / HAZ (ps)
24h
Reply SLA
Reference gallery
Real samples from our lab
Recommended platforms
Systems to build this line
Also explore
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