UV & Green Laser · Cold process
PCB / FPC
Cold-process cutting, drilling and windowing for flex-circuits, cover-films, rigid-flex and HDI substrates.
355 nm UV and 532 nm green laser processes deliver zero carbonisation, zero delamination and micron-level positioning for the world's most demanding flex-circuit programs.
Process types
- FPC depaneling
- Cover-film windowing
- Rigid-flex layer opening
- Copper foil drilling
- HDI via generation
- Fingerprint chip singulation
Processes
Showcase
FPC depaneling
Single- and double-sided flex-circuit cutting with ± 25 µm CPK ≥ 1.33.
PCB external cutting
Precision routing of FR4 and hard boards without mechanical stress.
Copper removal & pad opening
UV laser copper-foil stripping and precision pad opening.
Rigid-flex cover opening
Layer-selective cover-film windowing on rigid-flex assemblies.
Substrate micro-drilling
50 µm micro-vias in copper foil and specialty substrates.
Gallery
Sample cutting archive
Click any image to view full size — 22 samples from our Shenzhen lab.
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