Smartphones · Wearables · Cameras
Consumer Electronics
From fingerprint sensor singulation to camera-module cutting and sapphire cover glass — HOYAN LASER powers the highest-precision steps behind flagship consumer devices.
Challenges
What this sector demands
Sub-micron alignment for tiny sensors and modules
Zero-carbonisation cuts on flex circuits & cover films
Chip-free edges on cover glass & sapphire
Ramp-up from R&D to millions per month
Processes
How HOYAN LASER answers
Fingerprint chip singulation
UV-picosecond cutting with ± 5 µm accuracy, CPK ≥ 1.33.
Camera-module cutting
Cold-process cutting for CMOS packaging without micro-crack.
Cover-glass / sapphire
Green-picosecond profiling for smartphone and wearable covers.
SMT stencils for main-board assembly
IPG fiber cutting up to 50 000 pads / hour.
Key metrics
Precision, at a glance
± 5 µm
Chip singulation
CPK 1.33+
Process capability
24/7
Volume production
24h
Reply SLA
Reference gallery
Real samples from our lab
Recommended platforms
Systems to build this line
Also explore
Other industries
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