Brittle Materials
Micro-hole drilling, precision cutting and slot machining for sapphire, glass, ceramic substrates and optical filters.
Ultrashort pulse cold-processing removes material without inducing thermal stress — delivering chip-free edges and micron-level features across the toughest brittle materials.
Process types
- Sapphire cutting
- Cover-glass edging
- Ceramic micro-drilling
- Optical filter cutting
- Full-screen contours
- Slot & window machining
Showcase
Sapphire cutting
Ultra-precise sapphire cutting for camera modules and covers.
Glass cutting
Chip-free glass edging for cover glass and display components.
Glass slot & window
Precision slotting and windowing in tempered and ultra-thin glass.
Ceramic micro-holes
Micron-scale drilling in alumina and specialty ceramics.
Optical filter cutting
Precision cutting of optical filters with edge-quality control.
Full-screen cover cutting
Curved and full-screen display cover cutting.
Sample cutting archive
Click any image to view full size — 19 samples from our Shenzhen lab.
Platforms for this application
Other applications
Bring us your toughest job.
Free sample cutting. Full CPK & photo report. Reply within one business day.