10.6 µm CO₂ · Non-metal cold cutting
CO₂ Laser Systems
RF CO₂ laser platforms for large-format non-metal precision cutting — from touch-panel films and OCA to leather, carbon fiber, and PCB / FPC materials.
HYC600
10.6 µm CO₂ · Non-metal cold cutting
HYC600
Compact CO₂ precision cutter
Compact CO₂ cutter with imported RF laser tube for stable optical delivery and premium cut quality on a wide range of non-metal materials.
Applications
- Touch-panel PET / OCA / capacitive-screen films
- Cover-lens films, conductive & optical films
- Polarizers, backlight units, light guides
- PCB / FPC, ceramic substrates
- IT plastics, leather, carbon fiber
Key advantages
- Imported RF laser tube — long life & stable delivery
- Fly-optics for large-format cutting without re-positioning
- Marble base with closed monobloc structure
- Full fume/dust extraction & waste collection
- EasyCut proprietary software
- 3× cutting speed vs comparable models
Technical SpecificationsAll values typical
| Parameter | HYC600 |
|---|---|
| Laser | CO₂ RF · 30–100 W |
| Working area | 800 × 600 mm |
| Cutting speed | 100–4000 mm/s |
| Accuracy | ± 50 µm · CPK ≥ 1.33 |
| Min hole | 0.4 mm |
| Software | ScanCutPro / EasyCut |
HYC800-CO₂ / MicroCarbon 8600
10.6 µm CO₂ · Non-metal cold cutting
HYC800-CO₂ / MicroCarbon 8600
Gantry dual-drive CO₂ for large panels
Gantry dual-drive CO₂ system with option of scanning-head, cutting-head or flying-scan module. Designed for large-panel non-metal materials up to 8 mm thickness.
Applications
- PCB / FPC · ceramic substrates
- PET / PI films · non-metal panels
- Automotive interior · packaging materials
Key advantages
- Gantry dual-drive linear motor / servo motion
- Selectable galvo or cutting-head processing
- Real-time chiller with ± 0.1 °C temperature control
- MES-ready · barcode traceability
Configurations
- ● A. Galvo scanning
- ● B. Cutting head
- ● C. Fly-scan module
Technical SpecificationsAll values typical
| Parameter | HYC800-CO₂ / MicroCarbon 8600 |
|---|---|
| External dims | 1600 × 1600 × 1600 mm ± 20 mm |
| Weight | 1500 kg |
| Working area | 800 × 600 mm |
| Laser | CO₂ 30–100 W |
| Cutting speed | 100–4000 mm/s |
| Thickness | ≤ 8 mm |
| Min hole | 0.4 mm |
| Process accuracy | ± 50 µm · CPK ≥ 1.33 |
Applications
What these platforms cut
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