Custom Automation & Roll-to-Roll
Turn-key laser automation for BGA solder-mask opening, PI film singulation, roll-to-roll QR marking, laser de-lacquering and COF flexible-circuit exposure — engineered to plug directly into your line.
MicroApert 6550 — BGA Solder-Mask Opening
Full-line customization · dual-side processing
Automated CO₂ 150 W BGA solder-mask opening system with robotic loading/unloading and optional dual-side processing. Configurable as a stand-alone or fully-integrated line.
Applications
- BGA solder-mask window opening
- PCB / PET / PI insulation film cutting
- Precision non-metal windowing
Key advantages
- Robotic arm loading — 300 kg cart capacity
- Vision-guided alignment · ± 1 mm feed accuracy
- Chiller with ± 0.1 °C precision
- MES-ready · barcode traceability
| Parameter | MicroApert 6550 — BGA Solder-Mask Opening |
|---|---|
| External dims | 4525 × 3000 × 2160 mm ± 20 mm |
| Weight | 6000 kg |
| Working area | 750 × 1000 mm |
| Laser | CO₂ 150 W · spot 40 ± 5 µm |
| Thickness | ≤ 10 mm |
| Scanning range | 60 × 60 mm |
| Cutting speed | 100–4000 mm/s |
| Process accuracy | ± 25 µm · CPK ≥ 1.33 |
| X-Y accuracy | ± 5 µm |
MicroApert 9700 — Hard-Board Line
4-head in-line · dual-side · 12 t line weight
Full 4-head in-line configuration for hard-board solder-mask opening. 12 t total weight, up to 100 A supply, and dual-side processing built for continuous production.
Applications
- Hard-board BGA solder-mask opening at scale
- Rigid PCB dual-side windowing
Key advantages
- 4 × CO₂ 150 W in-line laser configuration
- Robotic loading with 300 kg cart capacity
- MES-ready and barcode traceable
- ● A. 4-head in-line (dual-side)
- ● B. Single-machine 2-head (single-side)
| Parameter | MicroApert 9700 — Hard-Board Line |
|---|---|
| External dims | 9050 × 3000 × 2160 mm ± 20 mm |
| Weight | 12000 kg (line) |
| Laser | 4 × CO₂ 150 W |
| Working area | 750 × 1000 mm |
| Cutting speed | 100–4000 mm/s |
| Process accuracy | ± 25 µm · CPK ≥ 1.33 |
POD-4000 — Automatic Laser De-Lacquering
UV pulse laser · replaces chemical stripping & sanding
The POD-4000 uses UV pulse laser for precision stripping of solder mask, conformal coating and insulation coatings from PCB / FPC. Fully automatic vision alignment, ready to plug into single-platform or dual-station lines.
Applications
- Local solder-mask removal on FPC / PCB
- Conformal coating / three-proof paint stripping
- Pad opening on ultra-fine circuits
Key advantages
- Small spot for pad-level precision stripping
- No base-material damage — non-contact cold process
- No consumables · CPK ≥ 1.33
- Sealed enclosure · safety grid · interlocks
- CCD Mark alignment · one-click batch startup
- Integrated fume extraction meets cleanroom standards
MicroScan 5000 Double — Automatic PI Cutter
355 nm UV cold laser · dual-station exchange
Automatic PI film / cover film cutter using 355 nm UV cold laser. Dual-station exchange means loading and cutting happen simultaneously — ideal for volume FPC / rigid-flex production.
Applications
- Single-sheet FPC & rigid-flex cover-film cutting + stiffener bonding
- Automotive / industrial FR4 auxiliary sheet cutting
- Camera and fingerprint module insulator processing
- HDI hard-board & connector PCB volume sheet automation
Key advantages
- Dual-platform exchange — zero idle time
- 355 nm cold UV — no carbonisation, no delamination
- Integrated cutting + transport in one machine
- Barcode / MES traceability · safety interlocks
- Linear motor + galvo · micron-level positioning
Roll-to-Roll QR Laser Marker
Continuous in-line coding for reel materials
Fully-automatic reel-material coding system: unwind → EPC edge-tracking → vision → laser mark → in-line code verification → rewind. Ideal for FPC, PI, aluminium & copper foil, PCB reel materials and labels.
Applications
- PI / cover-film / FPC flexible reel traceability
- Copper & aluminium foil traceability
- Label film / PET / PC plastic reel anti-counterfeit codes
- PCB reel materials, shielding & thermal films
- 3C electronics · new-energy · packaging one-item-one-code
Key advantages
- Continuous roll-to-roll marking — line-rate throughput
- Laser-engraved permanent marks — no fading, no ink
- EPC + vision double positioning for consistent placement
- Flexible data editing, low maintenance cost
- Interlocks with cutting / laminating for full-line automation
Roll-to-Roll COF Exposure System
Ultra-fine COF flex-circuit lithography
Core COF chip-on-flex lithography platform. Continuous roll-to-roll UV exposure of coated COF carrier onto photoresist, delivering ultra-fine pin traces for OLED / LCD driver COF production.
Applications
- OLED / LCD driver COF carrier exposure
- High-end flexible IC package film routing
- Narrow-bezel & foldable-display COF traces
Key advantages
- Continuous reel production for large-scale COF lines
- Micron-level alignment for ultra-fine pin traces
- Full-loop tension control — no film distortion
- Fast product changeover with reusable optics
- Choice of film-mask or DI (direct imaging)
- ESD control, dust extraction, safety interlocks
What these platforms cut
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