UV-picosecond lasers combine short-wavelength absorption with ultra-short pulse duration to deliver truly cold-process cutting of flex circuits. This article walks through the physics, key parameters, and process windows for depaneling PI-based FPCs from 0.05 mm to 0.3 mm.
We compare picosecond vs. nanosecond UV, discuss cover-film alignment strategies, and share our recommended process window for common flex builds. Contact our engineering team for a free process review of your specific stack-up.
